Simtec TechTalks in Romania
Exclusive live event • Only 10 seats per session
- 6 November 2025 - CFD & FEA
- 13 November 2025 - Electromagnetics
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Simtec TechTalks in Romania!
Simulation Insights, Networking, and Local Innovation
Invite-Only | 10 Seats Per Session
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- Location: Simtec Software Romania Office, Bucharest
- Dates: November 6 & 13, 2025
- Duration: 2h per session
Powered by Simtec, the Elite Certified Channel Partner of Ansys part of Synopsys
6 Nov 2025 - Session 1
Simulating Impact with FSI
Beyond Testing: Simulating Bullet Impacts with Fluid-Structure Interaction
09:00 - 11:00Testing high-speed impacts with physical prototypes is costly and limited. In this demo, discover how simulation with Ansys LS-DYNA and FSI coupling provides detailed insights into material behavior under extreme conditions. See how engineers can explore more scenarios virtually, reduce costly testing, and design safer systems faster.
13 Nov 2025 - Session 2
Electronics Cooling
Cooler Designs, Faster Decisions: Virtual Prototyping of Electronics Cooling with Ansys Icepak
09:00 - 11:00Electronics cooling is a growing challenge in modern designs. In this demo, discover how Icepak AEDT enables accurate electro-thermal simulation of electronics, helping engineers predict hotspots, optimize cooling strategies, and avoid costly redesigns. See how simulation accelerates electronics development while improving reliability.
Detailed Agenda:
Simulating Impact with FSI & Ballistics Simulation (2h00)
- | Welcome Coffee and Networking
- | Opening Talk: Why Simulation? Exploring What Physical Prototypes Can’t Show
- | Live Demos:
- Simulating Impact – Bullet Crash in Ansys LS-DYNA with FSI Coupling
- Ballistic Perforation Analysis – 7.62 mm Projectile vs. Quasi-Fluid Target (Ballistic Gel)
- | Roundtable Discussion 1: Where do physical crash tests cost you most, setup, time, or iteration?
- | Roundtable Discussion 2: How do you currently test for penetration or failure, and what are the limits?
- | Wrap-up and Networking
Electronics Cooling with Ansys Icepak (2h00)
- | Welcome Coffee and Networking
- | Opening Talk: Smarter Design Decisions: How Simulation Strengthens Electronics and Beyond
- | Live Demo: Electronics Cooling with Icepak AEDT – Electro-Thermal Analysis in Action
- | Roundtable Discussion 1: The Hidden Costs of Overheating in Electronics – Failures, Redesigns, Delays
- | Roundtable Discussion 2: Simulation vs Lab – How Do You Build Confidence in Thermal Predictions?
- | Wrap-up and Networking
What Each Session Includes?
- Welcome coffee and networking
- Live simulation demo
- Expert spotlight: What is new in simulation that matters
- Roundtable discussion with peers and experts
About Simtec
As an Ansys Elite Channel Partner, Simtec empowers engineering teams across Europe with world-class simulation tools, training, and expertise. At Tech Talks Romania, you’ll see firsthand how simulation can reshape product development and deliver measurable results.