As the semiconductor industry continues to push toward higher performance and smaller devices, 3D integrated circuits (3D ICs) are becoming increasingly important. By stacking chips vertically, engineers can reduce interconnect lengths, improve speed, and lower power consumption.

The continuous demand for advanced technologies such as artificial intelligence, Internet of Things systems, autonomous vehicles, and high-performance computing has driven integrated circuits to operate at increasingly higher frequencies.

As traditional transistor scaling approaches its physical and economic limits, the semiconductor industry is increasingly turning to 3D integrated circuits (3D ICs) to extend Moore’s Law.